18 May 2015
PCB Sponsoring Technikum Wien

Oregano Systems sponsored the production of three multi-layer printed-circuit-board panels including a professional solder-paste stencil at a value of some 1000 Euro for students of the faculty Electronics at the University of Applied Sciences FH Technikum Wien.


That enabled several students to professionally realize their first complex electronic circuits.


“With that activity we wanted to send a clear signal by supporting students in gaining hands-on experience with modern electronic circuits and electronic design software. We need highly qualified engineers having gained practical experience during their education, to remain internationally successful in a competitive environment operating in a high-price country like Austria.”

— Dr. Gerhard Cadek, General Manager of Oregano Systems


“The professional implementation of practical projects and tasks incurs extra costs, which are often difficult to finance considering the tight budgets of FH degree programs. Therefore, we are very grateful that Oregano Systems agreed to take over the production costs for these multi-layer printed-circuit-board panels.”

— Prof (FH) Dr. Martin Horauer, academic leader of electronics at the University of Applied Sciences FH Technikum Wien

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